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Hand Assembly
Pads located on the bottom of the
Castellations
module are the primary mount-
ing surface. Since these pads are
inaccessible during mounting,
castellations that run up the side
of the module have been provided
to facilitate solder wicking to the
module’s underside. This allows
for very quick hand soldering
for prototyping and small volume
Soldering Iron
Tip
Solder
PCB Pads
Figure 29: Soldering Technique
production.
If the recommended pad guidelines have been followed, the pads will
protrude slightly past the edge of the module. Use a fine soldering tip to
heat the board pad and the castellation, then introduce solder to the pad
at the module’s edge. The solder will wick underneath the module,
providing reliable attachment. Tack one module corner first and then work
around the device, taking care not to exceed the times listed below.
!
Warning: Pay attention to the absolute maximum solder times.
Absolute Maximum Solder Times
Hand Solder Temperature TX: +225oC for 10 seconds
Hand Solder Temperature RX: +225oC for 10 seconds
Recommended Solder Melting Point: +218oC
Reflow Oven: +255°C Max. (See Figure 31)
Figure 30: Absolute Maximum Solder Times
– 25 –
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